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 2SC5703
TOSHIBA Transistor Silicon NPN Epitaxial Type
2SC5703
High-Speed Switching Applications DC-DC Converter Applications Strobe Applications
* * * High DC current gain: hFE = 400 to 1000 (IC = 0.5 A) Low collector-emitter saturation voltage: VCE (sat) = 0.12 V (max) High-speed switching: tf = 55 ns (typ.) Unit: mm
Absolute Maximum Ratings (Ta = 25C)
Characteristics Collector-base voltage Collector-emitter voltage Collector-emitter voltage Emitter-base voltage Collector current Base current Collector power dissipation Junction temperature Storage temperature range DC t = 10 s DC Pulse Symbol VCBO VCEX VCEO VEBO IC ICP IB PC (Note 1) Tj Tstg Rating 100 80 50 7 4 7 400 800 1250 150 -55 to 150 Unit V V V V A
JEDEC
mA mW C C
2-3S1A
JEITA TOSHIBA
Weight: 0.01 g (typ.)
Note 1: Mounted on an FR4 board (glass epoxy, 1.6 mm thick, Cu area: 645 mm2) Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
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2006-11-10
2SC5703
Electrical Characteristics (Ta = 25C)
Characteristics Collector cut-off current Emitter cut-off current Collector-emitter breakdown voltage DC current gain Collector-emitter saturation voltage Base-emitter saturation voltage Collector output capacitance Rise time Switching time Storage time Fall time Symbol ICBO IEBO V (BR) CEO hFE (1) hFE (2) VCE (sat) VBE (sat) Cob tr tstg tf Test Condition VCB = 100 V, IE = 0 VEB = 7 V, IC = 0 IC = 10 mA, IB = 0 VCE = 2 V, IC = 0.5 A VCE = 2 V, IC = 1.6 A IC = 1.6 A, IB = 32 mA IC = 1.6 A, IB = 32 mA VCB = 10 V, IE = 0, f = 1 MHz See Figure 1 circuit diagram. VCC 30 V, RL = 19 - IB1 = -IB2 = 53.3 mA Min 50 400 200 Typ. 26 45 700 55 Max 100 100 1000 0.12 1.10 ns V V pF Unit nA nA V
Marking
VCC 20 s RL IB1 IB1 Output Part No. (or abbreviation code)
Input IB2
W
Lot code (year) Dot: even year No dot: odd year
A
Lot code (month)
IB2 Duty cycle < 1%
Figure 1
Switching Time Test Circuit & Timing Chart
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2SC5703
IC - VCE
5 Common emitter Ta = 25C Single nonrepetitive pulse 4 60 10000 50 40 30 20 3 10 2 5 2 IB = 1 mA 0 0 0.2 0.4 0.6
hFE - IC
(A)
Ta = 100C 1000
DC current gain hFE
Collector current IC
25 100
-55
1
10 Common emitter VCE = 2 V Single nonrepetitive pulse 1 0.001 0.01 0.1 1 10
Collector-emitter voltage VCE (V)
Collector current IC
(A)
VCE (sat) - IC
1
VBE (sat) - IC
10
Collector-emitter saturation voltage VCE (sat) (V)
0.1 Ta = 100C -55 0.01 25
Base-emitter saturation voltage VBE (sat) (V)
Common emitter IC/IB = 50 Single nonrepetitive pulse
Common emitter IC/IB = 50 Single nonrepetitive pulse
1
Ta = 100C
25
-55
0.001 0.001
0.01
0.1
1
10
0.1 0.001
0.01
0.1
1
10
Collector current IC
(A)
Collector current IC
(A)
IC - VBE
5 Common emitter VCE = 2 V Single nonrepetitive pulse
Collector current IC
(A)
4
3
2
1
Ta = 100C
25
-55
0 0
0.4
0.8
1.2
Base-emitter voltage
VBE (V)
3
2006-11-10
2SC5703
rth - tw
1000
Transient thermal resistance rth (C/W)
100
10 Curves should be applied in thermal limited area. Single nonrepetitive pulse area: 645 mm2) 1 0.001 0.01 0.1 1 10 100 1000 Ta = 25C Mounted on an FR4 board (glass epoxy, 1.6 mm thick, Cu
Pulse width
tw (s)
Safe Operating Area
10 IC max (pulsed) 10 ms 1 ms 100 s 10 s IC max (continuous) 100 ms*
(A) Collector current IC
1 10 s* DC operation* (Ta = 25C) : Single nonrepetitive pulse Ta = 25C Note that the curves for 100 ms*, 10 s* and DC operation* will be different when the devices aren't mounted on an FR4 board (glass epoxy, 1.6 mm thick, Cu area: 645 mm2). These characteristic curves must be derated linearly with increase in temperature. 1 10 0.1
0.01 0.1
VCEO max 100
Collector-emitter voltage VCE (V)
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2006-11-10
2SC5703
RESTRICTIONS ON PRODUCT USE
* The information contained herein is subject to change without notice.
20070701-EN
* TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer's own risk. * The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. * Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations.
5
2006-11-10


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